CVE Vulnerabilities

CVE-2021-38394

Missing Protection Against Hardware Reverse Engineering Using Integrated Circuit (IC) Imaging Techniques

Published: Oct 04, 2021 | Modified: Oct 13, 2021
CVSS 3.x
6.4
MEDIUM
Source:
NVD
CVSS:3.1/AV:P/AC:H/PR:N/UI:N/S:U/C:H/I:H/A:H
CVSS 2.x
6.9 MEDIUM
AV:L/AC:M/Au:N/C:C/I:C/A:C
RedHat/V2
RedHat/V3
Ubuntu

An attacker with physical access to the device can extract the binary that checks for the hardware key and reverse engineer it, which could be used to create a physical duplicate of a valid hardware key. The hardware key allows access to special settings when inserted.

Weakness

Information stored in hardware may be recovered by an attacker with the capability to capture and analyze images of the integrated circuit using techniques such as scanning electron microscopy.

Affected Software

Name Vendor Start Version End Version
Zoom_latitude_pogrammer/recorder/monitor_3120_firmware Bostonscientific * *

Extended Description

The physical structure of a device, viewed at high enough magnification, can reveal the information stored inside. Typical steps in IC reverse engineering involve removing the chip packaging (decapsulation) then using various imaging techniques ranging from high resolution x-ray microscopy to invasive techniques involving removing IC layers and imaging each layer using a scanning electron microscope. The goal of such activities is to recover secret keys, unique device identifiers, and proprietary code and circuit designs embedded in hardware that the attacker has been unsuccessful at accessing through other means. These secrets may be stored in non-volatile memory or in the circuit netlist. Memory technologies such as masked ROM allow easier to extraction of secrets than One-time Programmable (OTP) memory.

Potential Mitigations

References