CVE Vulnerabilities

CVE-2022-42784

Improper Protection against Electromagnetic Fault Injection (EM-FI)

Published: Dec 12, 2023 | Modified: Nov 21, 2024
CVSS 3.x
6.8
MEDIUM
Source:
NVD
CVSS:3.1/AV:P/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
CVSS 2.x
RedHat/V2
RedHat/V3
Ubuntu

A vulnerability has been identified in LOGO! 12/24RCE (6ED1052-1MD08-0BA1) (All versions >= V8.3), LOGO! 12/24RCEo (6ED1052-2MD08-0BA1) (All versions >= V8.3), LOGO! 230RCE (6ED1052-1FB08-0BA1) (All versions >= V8.3), LOGO! 230RCEo (6ED1052-2FB08-0BA1) (All versions >= V8.3), LOGO! 24CE (6ED1052-1CC08-0BA1) (All versions >= V8.3), LOGO! 24CEo (6ED1052-2CC08-0BA1) (All versions >= V8.3), LOGO! 24RCE (6ED1052-1HB08-0BA1) (All versions >= V8.3), LOGO! 24RCEo (6ED1052-2HB08-0BA1) (All versions >= V8.3), SIPLUS LOGO! 12/24RCE (6AG1052-1MD08-7BA1) (All versions >= V8.3), SIPLUS LOGO! 12/24RCEo (6AG1052-2MD08-7BA1) (All versions >= V8.3), SIPLUS LOGO! 230RCE (6AG1052-1FB08-7BA1) (All versions >= V8.3), SIPLUS LOGO! 230RCEo (6AG1052-2FB08-7BA1) (All versions >= V8.3), SIPLUS LOGO! 24CE (6AG1052-1CC08-7BA1) (All versions >= V8.3), SIPLUS LOGO! 24CEo (6AG1052-2CC08-7BA1) (All versions >= V8.3), SIPLUS LOGO! 24RCE (6AG1052-1HB08-7BA1) (All versions >= V8.3), SIPLUS LOGO! 24RCEo (6AG1052-2HB08-7BA1) (All versions >= V8.3). Affected devices are vulnerable to an electromagnetic fault injection. This could allow an attacker to dump and debug the firmware, including the manipulation of memory. Further actions could allow to inject public keys of custom created key pairs which are then signed by the product CA. The generation of a custom certificate allows communication with, and impersonation of, any device of the same version.

Weakness

The device is susceptible to electromagnetic fault injection attacks, causing device internal information to be compromised or security mechanisms to be bypassed.

Affected Software

Name Vendor Start Version End Version
6ed1052-1md08-0ba1_firmware Siemens * 8.3 (including)

Extended Description

Electromagnetic fault injection may allow an attacker to locally and dynamically modify the signals (both internal and external) of an integrated circuit. EM-FI attacks consist of producing a local, transient magnetic field near the device, inducing current in the device wires. A typical EMFI setup is made up of a pulse injection circuit that generates a high current transient in an EMI coil, producing an abrupt magnetic pulse which couples to the target producing faults in the device, which can lead to:

Potential Mitigations

References